Superhydrophobic Copper Surfaces with Anticorrosion Properties Fabricated by Solventless CVD Methods

Engineering

• Chemical Vapor Deposition 100%
• Vapor Deposition Method 100%
• Vapor Deposition 100%
• Step Process 20%
• Corrosion Rate 20%
• Copper Substrate 20%
• Ar Plasma 20%
• Corrosion Attack 20%
• Three Dimensional Integrated Circuits 20%
• Extended Period 20%
• Periodic Time 20%
• Energy Surface 20%
• Nanoscale 20%
• Water Contact Angle 20%
• Deposition Process 20%

Material Science

• Chemical Vapor Deposition 100%
• Superhydrophobic 100%
• Ultrahydrophobic Coating 40%
• Corrosion 40%
• Copolymer 40%
• Contact Angle 20%
• Plasma Etching 20%
• Surface Modification 20%
• Electrical Component 20%
• Scanning Electron Microscopy 20%
• Electronic Circuit 20%
• Surface Energy 20%
• Vapor Phase Deposition 20%