TY - GEN
T1 - EM isolation enhancement based on metamaterial concept in antenna array system to support full-duplex application
AU - Alibakhshikenari, Mohammad
AU - Vittori, Marco
AU - Colangeli, Sergio
AU - Virdee, Bal S.
AU - Andújar, Aurora
AU - Anguera, Jaume
AU - Limiti, Ernesto
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/6/28
Y1 - 2017/6/28
N2 - This paper proposes EM mechanism to improve the isolation between transmitting and receiving array antennas using metamaterial EM band gap (MTM-EBG). The proposed mechanism can be applied to full-duplex array antenna system with very closely spaced arrays (0.33λ0) with no degradation in radiation pattern. Using the proposed technique the isolation is shown to improve by >30 dB in an antenna array consisting of three-element microstrip patches designed to operate across 9.7 to 12.3 GHz. Parametric analysis was used to optimise the decoupling arrays performances. The proposed antenna array has physical dimensions of 65×22.5×1.6 mm3 and an electrical size of 2.16λ0×0.75λ0×0.053λ0, where λ0 is free space-wavelength at mid-band of 10 GHz.
AB - This paper proposes EM mechanism to improve the isolation between transmitting and receiving array antennas using metamaterial EM band gap (MTM-EBG). The proposed mechanism can be applied to full-duplex array antenna system with very closely spaced arrays (0.33λ0) with no degradation in radiation pattern. Using the proposed technique the isolation is shown to improve by >30 dB in an antenna array consisting of three-element microstrip patches designed to operate across 9.7 to 12.3 GHz. Parametric analysis was used to optimise the decoupling arrays performances. The proposed antenna array has physical dimensions of 65×22.5×1.6 mm3 and an electrical size of 2.16λ0×0.75λ0×0.053λ0, where λ0 is free space-wavelength at mid-band of 10 GHz.
KW - Mutual coupling suppression
KW - decoupling arrays
KW - electromagnetic band gap
KW - full-duplex wireless transceivers
KW - isolation enhancement
KW - metamaterial
UR - http://www.scopus.com/inward/record.url?scp=85044751717&partnerID=8YFLogxK
U2 - 10.1109/APMC.2017.8251553
DO - 10.1109/APMC.2017.8251553
M3 - Conference contribution
AN - SCOPUS:85044751717
T3 - Asia-Pacific Microwave Conference Proceedings, APMC
SP - 740
EP - 742
BT - 2017 Asia Pacific Microwave Conference, APMC 2017 - Proceedings
A2 - Pasya, Idnin
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2017 IEEE Asia Pacific Microwave Conference, APMC 2017
Y2 - 13 November 2017 through 16 November 2017
ER -