Bioimplant-on-a-chip For Investigating Osseointegration Of Periodontal Ligament-like Tissues On Bioengineered Implants

J. Chung; S. Park; J. Kim; J. Han; Y. Gwon; M. Lee; J. Lim; S. Jeong; J. Lee; P. Garg; S. Pandey; J. Kim; H. Seonwoo; K. Jang

Bioimplant-on-a-chip For Investigating Osseointegration Of Periodontal Ligament-like Tissues On Bioengineered Implants

J. Chung
, S. Park
, J. Kim
, J. Han
, Y. Gwon
, M. Lee
, J. Lim
, S. Jeong
, J. Lee
, P. Garg
, S. Pandey
, J. Kim
, H. Seonwoo
, K. Jang

Producció científica: Article en revista indexada › Resum de jornada › Avaluat per experts

Idioma original	Anglès
Pàgines (de-a)	362-363
Nombre de pàgines	2
Revista	Tissue Engineering - Part A
Volum	28
Número	Supplement 2
Estat de la publicació	Publicada - 1 d’ag. 2022
Publicat externament	Sí

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@article{a09bd45759c44f48893cb504816f06ad,

title = "Bioimplant-on-a-chip For Investigating Osseointegration Of Periodontal Ligament-like Tissues On Bioengineered Implants",

author = "J. Chung and S. Park and J. Kim and J. Han and Y. Gwon and M. Lee and J. Lim and S. Jeong and J. Lee and P. Garg and S. Pandey and J. Kim and H. Seonwoo and K. Jang",

year = "2022",

month = aug,

day = "1",

language = "English",

volume = "28",

pages = "362--363",

journal = "Tissue Engineering - Part A",

issn = "1937-3341",

publisher = "Raz{\'o}n y Fe",

number = "Supplement 2",

}

TY - JOUR

T1 - Bioimplant-on-a-chip For Investigating Osseointegration Of Periodontal Ligament-like Tissues On Bioengineered Implants

AU - Chung, J.

AU - Park, S.

AU - Kim, J.

AU - Han, J.

AU - Gwon, Y.

AU - Lee, M.

AU - Lim, J.

AU - Jeong, S.

AU - Lee, J.

AU - Garg, P.

AU - Pandey, S.

AU - Kim, J.

AU - Seonwoo, H.

AU - Jang, K.

PY - 2022/8/1

Y1 - 2022/8/1

UR - https://www.webofscience.com/api/gateway?GWVersion=2&SrcApp=pure_univeritat_ramon_llull&SrcAuth=WosAPI&KeyUT=WOS:000848131900406&DestLinkType=FullRecord&DestApp=WOS_CPL

M3 - Meeting Abstract

SN - 1937-3341

VL - 28

SP - 362

EP - 363

JO - Tissue Engineering - Part A

JF - Tissue Engineering - Part A

IS - Supplement 2

ER -